The reality is, even systems that do dynamic bonding well has to make assumptions about whether there is a bond on the AC in. I do not know of anything on the market that can handle AC-in without bonding sometimes and AC-in with bonding other times. It could be done with modern electronics that detect if a bond exists or not, but I am not aware of any current inverter product with that capability.
So true!!! The 6000XP has a design center of stationary installs. Trying to apply it to mobile is a little bit of a square peg and round hole situation.